DocumentCode
3482412
Title
A New Approach to Signal Integrity Analysis of High-Speed Packaging
Author
Chen, Yuzhe ; Chen, Zhaoqing ; Wu, Zhonghua ; Xue, Danwei ; Fang, Jiayuan
fYear
1995
fDate
2-4 Oct 1995
Firstpage
235
Keywords
Analytical models; Circuit simulation; Delay; Distortion; Electromagnetic analysis; Electromagnetic fields; Electromagnetic reflection; Packaging; Signal analysis; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.526275
Filename
526275
Link To Document