DocumentCode :
3482412
Title :
A New Approach to Signal Integrity Analysis of High-Speed Packaging
Author :
Chen, Yuzhe ; Chen, Zhaoqing ; Wu, Zhonghua ; Xue, Danwei ; Fang, Jiayuan
fYear :
1995
fDate :
2-4 Oct 1995
Firstpage :
235
Keywords :
Analytical models; Circuit simulation; Delay; Distortion; Electromagnetic analysis; Electromagnetic fields; Electromagnetic reflection; Packaging; Signal analysis; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Print_ISBN :
0-7803-3034-X
Type :
conf
DOI :
10.1109/EPEP.1995.526275
Filename :
526275
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3482412
