• DocumentCode
    3482413
  • Title

    Effects of thermal contact resistance and thomson heating on the outputs of solar thermoelectric power generation system

  • Author

    Admasu, Bimrew Tamrat ; Xiaobing Luo

  • Author_Institution
    Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    1260
  • Lastpage
    1263
  • Abstract
    We establish a mathematical model with numerical example of solar thermoelectric power generation system. The components´ thermal resistances, thermal contact resistances at the interface between components and Thomson heating are all considered in the model. The inner effects include Seebeck effect, Peltier heating effect, Thomson effect and Joule effect. The thermoelectric material properties are all temperature dependent. From the mathematical model, the junction temperatures, the rate of heat flow at the junctions, the power output from the system and thermal efficiency of the system are formulated. Applying the model to a practical example in engineering, the system is evaluated to identify the effect of thermal contact resistance between components and the Thomson effect. The results indicate that neglecting thermal contact resistance between components and Thomson effect highly influences on the outputs of the system.
  • Keywords
    Peltier effect; Seebeck effect; Thomson effect; contact resistance; solar power stations; thermoelectric conversion; thermoelectric power; Joule effect; Peltier heating effect; Seebeck effect; Thomson effect; heat flow; junction temperatures; solar thermoelectric power generation system; thermal contact resistance; thermoelectric material properties; thomson heating; Contact resistance; Heat sinks; Heat transfer; Junctions; Power generation; Resistance heating; Thermal resistance; Thomson heating; temperature dependent material property; thermal contact resistance; thermoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756686
  • Filename
    6756686