Title :
Structure-air damping coupling analysis of micromachined gyroscope
Author :
Weihui Wang ; Zhang Luo ; Qiang Dan ; Yong Xu ; Sheng Liu
Author_Institution :
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
This paper presents a method to calculate the air damping coefficient and the quality factor value in MEMS gyroscope at different cavity pressures. Taking the structure of MEMS gyroscope as an example, firstly, the authors derived the simplified M-C-K dynamic model. Then, the elements of mass matrix and stiffness matrix were calculated based on certain assumptions, especially the air damping coefficient with the theory of slide-film damping and squeeze-film damping. Finally, with relative elements of mass, damping and stiffness matrix, we obtained the quality factors Qs in the driving direction and the sensing direction at different cavity pressures. The results showed that the quality factors Qs both in the driving direction and the sensing direction increase with the decrease of the cavity pressure, and the quality factor Q in the driving direction is much bigger than that in the sensing direction.
Keywords :
Q-factor; gyroscopes; micromechanical devices; MCK dynamic model; MEMS gyroscope; air damping coefficient; cavity pressures; damping matrix; mass matrix; micromachined gyroscope; quality factor value; slide film damping; squeeze film damping; stiffness matrix; structure air damping coupling analysis; Cavity resonators; Damping; Gyroscopes; Mathematical model; Micromechanical devices; Q-factor; Sensors; MEMS Gyroscope; quality factor; slide-film damping; squeeze-film damping;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756691