DocumentCode
3483369
Title
A quantitative assessment of the benefit of a learning community environment
Author
Castro-Cedeno, Mario H.
Author_Institution
Dept. of Mech. & Manufacturing Eng. Technol., Rochester Inst. of Technol., NY
fYear
2005
fDate
19-22 Oct. 2005
Lastpage
10
Abstract
An introductory course in manufacturing processes was taught to a cohort of engineering technology students participating in a learning community (LC) experiment and to a group of non-participating students. The LC students were all freshmen and took all the courses as a group. They were encouraged to work in teams. Non-LC students were also encouraged to work in teams but their class schedules were not coordinated. Data were collected on test scores, homework scores, and homework completion rates. The data show that the standard deviation of the grades distribution is significantly smaller for the LC group and that outliers with failing scores are not present. The non-LC group had a significant number of outliers with failing scores. These results are interpreted to mean that the LC was successful in integrating first year students into study groups. The study groups facilitate learning by increasing attendance, class participation, and homework completion
Keywords
educational courses; engineering education; production engineering; student experiments; class participation; engineering technology students; failing scores; grades distribution; homework completion rates; homework scores; learning community environment; manufacturing processes; standard deviation; test scores; Calculus; Cognitive science; Educational institutions; Engineering education; Instruments; Job shop scheduling; Manufacturing processes; Mathematics; Stress; Testing; Engineering; Engineering technology; First year; Learning communities; Manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education, 2005. FIE '05. Proceedings 35th Annual Conference
Conference_Location
Indianopolis, IN
ISSN
0190-5848
Print_ISBN
0-7803-9077-6
Type
conf
DOI
10.1109/FIE.2005.1612132
Filename
1612132
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