• DocumentCode
    3483369
  • Title

    A quantitative assessment of the benefit of a learning community environment

  • Author

    Castro-Cedeno, Mario H.

  • Author_Institution
    Dept. of Mech. & Manufacturing Eng. Technol., Rochester Inst. of Technol., NY
  • fYear
    2005
  • fDate
    19-22 Oct. 2005
  • Lastpage
    10
  • Abstract
    An introductory course in manufacturing processes was taught to a cohort of engineering technology students participating in a learning community (LC) experiment and to a group of non-participating students. The LC students were all freshmen and took all the courses as a group. They were encouraged to work in teams. Non-LC students were also encouraged to work in teams but their class schedules were not coordinated. Data were collected on test scores, homework scores, and homework completion rates. The data show that the standard deviation of the grades distribution is significantly smaller for the LC group and that outliers with failing scores are not present. The non-LC group had a significant number of outliers with failing scores. These results are interpreted to mean that the LC was successful in integrating first year students into study groups. The study groups facilitate learning by increasing attendance, class participation, and homework completion
  • Keywords
    educational courses; engineering education; production engineering; student experiments; class participation; engineering technology students; failing scores; grades distribution; homework completion rates; homework scores; learning community environment; manufacturing processes; standard deviation; test scores; Calculus; Cognitive science; Educational institutions; Engineering education; Instruments; Job shop scheduling; Manufacturing processes; Mathematics; Stress; Testing; Engineering; Engineering technology; First year; Learning communities; Manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education, 2005. FIE '05. Proceedings 35th Annual Conference
  • Conference_Location
    Indianopolis, IN
  • ISSN
    0190-5848
  • Print_ISBN
    0-7803-9077-6
  • Type

    conf

  • DOI
    10.1109/FIE.2005.1612132
  • Filename
    1612132