DocumentCode :
348436
Title :
Development of hot diodes with new thermal dissipating submount for space applications
Author :
Choi, S.H. ; Singh, U.N. ; Cutler, A.D.
Author_Institution :
NASA Langley Res. Center, Hampton, VA, USA
Volume :
2
fYear :
1999
fDate :
Aug. 30 1999-Sept. 3 1999
Firstpage :
541
Abstract :
Space-deployable LIDAR and micro-LIDAR, which are under development at NASA require laser diodes which have high power, high laser beam quality, beam stability, simplicity, and are lightweight. Long operational life is most desirable and crucial issues for a space-deployable LIDAR system are given. A stable operational temperature in laser diodes and solid-state lasers is the key factor determining both laser beam quality and stability. The heat absorbed by laser rod in turn causes a serious thermal lensing problem and the heat accumulated within the enclosure eventually causes level shifts of electron-state in laser diodes. This thermal lensing problem and possible level shifts reduce or even spoil the beam quality, stability and efficiency. Therefore, the thermal dissipation issue must be seriously considered in the design of laser diodes.
Keywords :
airborne radar; cooling; laser beams; optical pumping; optical radar; packaging; semiconductor lasers; thermal conductivity; thermal stability; NASA; beam quality; beam stability; electron-state; enclosure; high laser beam quality; hot laser diodes; long operational life; micro-LIDAR; space applications; space-deployable LIDAR; space-deployable LIDAR system; stable operational temperature; thermal dissipating submount; thermal lensing problem; Diode lasers; Laser beams; Laser radar; Laser stability; NASA; Power lasers; Solid lasers; Temperature; Thermal lensing; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 1999. CLEO/Pacific Rim '99. The Pacific Rim Conference on
Conference_Location :
Seoul, South Korea
Print_ISBN :
0-7803-5661-6
Type :
conf
DOI :
10.1109/CLEOPR.1999.811560
Filename :
811560
Link To Document :
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