Title :
The effects due to package parasitics of a PEBB-1 module in an ARCP circuit
Author :
Lewis, Robert A. ; Hudgins, Jerry L.
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
The parasitic capacitances, self-, and mutual-inductances of the Power Electronic Building Block (PEBB-1) module are extracted using a 3-D field solver. The elements are included in a circuit simulation of the Auxiliary Resonantly Commutated Pole (ARCP) converter topology. Comparisons of the performance with and without the parasitic elements is provided. Alternate control schemes are evaluated to compensate for the increased package losses
Keywords :
capacitance; circuit analysis computing; commutation; inductance; losses; packaging; resonant power convertors; 3-D field solver; ARCP circuit; Auxiliary Resonantly Commutated Pole converter; PEBB-1 module; Power Electronic Building Block; circuit simulation; mutual-inductance; package losses compensation; package parasitics effects; parasitic capacitances; self-inductance; Circuit simulation; Circuit topology; Electronics packaging; Geometry; Lead; Parasitic capacitance; Power electronics; Power system simulation; Resonance; Switches;
Conference_Titel :
Power Electronics Specialists Conference, 1998. PESC 98 Record. 29th Annual IEEE
Conference_Location :
Fukuoka
Print_ISBN :
0-7803-4489-8
DOI :
10.1109/PESC.1998.703447
