The effects due to package parasitics of a PEBB-1 module in an ARCP circuit

Author

Lewis, Robert A. ; Hudgins, Jerry L.

Author_Institution

Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA

Volume

2

fYear

1998

fDate

17-22 May 1998

Firstpage

1951

Abstract

The parasitic capacitances, self-, and mutual-inductances of the Power Electronic Building Block (PEBB-1) module are extracted using a 3-D field solver. The elements are included in a circuit simulation of the Auxiliary Resonantly Commutated Pole (ARCP) converter topology. Comparisons of the performance with and without the parasitic elements is provided. Alternate control schemes are evaluated to compensate for the increased package losses

Keywords

capacitance; circuit analysis computing; commutation; inductance; losses; packaging; resonant power convertors; 3-D field solver; ARCP circuit; Auxiliary Resonantly Commutated Pole converter; PEBB-1 module; Power Electronic Building Block; circuit simulation; mutual-inductance; package losses compensation; package parasitics effects; parasitic capacitances; self-inductance; Circuit simulation; Circuit topology; Electronics packaging; Geometry; Lead; Parasitic capacitance; Power electronics; Power system simulation; Resonance; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 1998. PESC 98 Record. 29th Annual IEEE

Conference_Location

Fukuoka

ISSN

0275-9306

Print_ISBN

0-7803-4489-8

Type

conf

DOI

10.1109/PESC.1998.703447

Filename

703447