DocumentCode :
3484852
Title :
Fluorine effects in BF2+ implants at various energies
Author :
Felch, S.B. ; Lee, B.S. ; Downey, D.F. ; Zhao, Z. ; Eddy, R.J.
Author_Institution :
Varian Res. Center, Palo Alto, CA, USA
fYear :
1996
fDate :
16-21 Jun 1996
Firstpage :
611
Lastpage :
614
Abstract :
The effects of fluorine co-implanted with boron in BF2 + implants at conventional energies (50-80 keV) are well-known. These effects include the pile-up of fluorine in regions of residual damage near the boron peak, the amorphous/crystalline interface, and the end of range, and the formation of fluorine bubbles after annealing. However, ultra-low energy BF2+ implants (below 5 keV) and plasma-doped samples do not show any of these effects. In order to identify the transition where the fluorine effects disappear, a series of BF2+ implants at energies ranging from 2 to 50 keV and doses of 5×1014 to 5×1015 cm-2 were performed. The implants were rapidly annealed at temperatures of 900-1000°C for 30 s and then analyzed using SIMS and TEM. The results suggest a dependency of these undesirable fluorine effects on ion energy, implant dose, and anneal temperature
Keywords :
annealing; boron compounds; elemental semiconductors; ion implantation; secondary ion mass spectra; silicon; transmission electron microscopy; 2 to 50 keV; 900 to 1000 C; BF2+ ion implantation; SIMS; Si:BF2; TEM; amorphous/crystalline interface; annealing; bubbles; end of range; fluorine pile-up; residual damage; Amorphous materials; Boron; Crystallization; Electrical resistance measurement; Implants; Manufacturing; Plasma temperature; Rapid thermal annealing; Silicon; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3289-X
Type :
conf
DOI :
10.1109/IIT.1996.586474
Filename :
586474
Link To Document :
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