Title :
Design of chip-type bandpass filter fabricated by LTCC
Author :
Wu, Guoan ; Bi, Xiaojun ; Tang, Qinghua ; Cheng, Yao
Author_Institution :
Dept. of Electron. Sci. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
In the RF wireless communication systems, high-performance, low-loss and compact size are the trends of passive integrated components. LTCC technology, as a novel multi-layer ceramic technology, with its high performance, high integration, high stability and low cost, has drawn wide attention in recent years. A fourth-order Chebyshev chip-type bandpass filter with a reasonable structure and stable performance is designed in this paper.
Keywords :
Chebyshev filters; band-pass filters; ceramic packaging; network synthesis; LTCC technology; RF wireless communication system; bandpass filter fabrication; chip-type bandpass filter design; fourth-order Chebyshev chip-type bandpass filter; multilayer ceramic technology; passive integrated component; Band pass filters; Ceramics; Coupling circuits; Filtering theory; Frequency; Grounding; Inductors; MIM capacitors; Resonance; Resonator filters;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958237
