• DocumentCode
    3485853
  • Title

    Stress Engineering for High-k FETs: Mobility and Ion Enhancements by Optimized Stress

  • Author

    Saitoh, Masumi ; Kobayashi, Shigeki ; Uchida, Ken

  • Author_Institution
    Corp. R&D Center, Yokohama
  • fYear
    2007
  • fDate
    12-14 June 2007
  • Firstpage
    132
  • Lastpage
    133
  • Abstract
    In this paper, we present the first systematic study of uniaxial/ biaxial stress effects on mobility (mu) and Ion enhancements in high-k n/pFETs. It is demonstrated for the first time that mu enhancement of high-k nFETs by biaxial strain is greater than that of SiO2 nFETs in high Eeff, resulting in the better Ion improvement of high-k nFETs than SiO2 nFETs particularly in shorter-channel regime. It is also shown that mu enhancement of high-k pFETs by strain is comparable to that of SiO2 pFETs. The optimum stress design for high-mu high-k n/pFETs is also discussed and it is concluded that the application of transverse tensile stress is crucial for improved n/pFETs.
  • Keywords
    field effect transistors; SiO2; biaxial strain; high-k FET; transverse tensile stress; uniaxial/ biaxial stress effects; Capacitive sensors; Degradation; FETs; High K dielectric materials; High-K gate dielectrics; Insulation; Scattering; Tensile strain; Tensile stress; Uniaxial strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2007 IEEE Symposium on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-900784-03-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.2007.4339756
  • Filename
    4339756