Title :
Millimeter waveguide fabrication to reduce transmission loss by diffusion bonding, light-curing resin or dielectric partially-filling
Author :
Hirokawa, Jiro ; Zhang, Miao ; Ando, Makoto
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo
Abstract :
We have discussed the three types of millimeter waveguides for reducing the transmission loss. The diffusion-bonding hollow-waveguide array of copper achieves 60% antenna efficiency for 31.4 dBi gain at 93.7 GHz. The hollow waveguide of laser-curing resin with copper electroplating with 25 mm length achieves -0.1 dB transmission at 94GHz. The dielectric half-filled parallel plate waveguide is expected to reduce the transmission loss by about 40% in 60GHz band.
Keywords :
copper; electroplating; laser beam applications; millimetre wave antennas; slot antenna arrays; Cu; antenna efficiency; copper electroplating; diffusion-bonding hollow-waveguide array; efficiency 60 percent; frequency 93.7 GHz; laser-curing resin; millimeter waveguide fabrication; size 25 mm; transmission loss; Dielectric losses; Diffusion bonding; Optical device fabrication; Propagation losses; Resins;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958261
