Title :
Hybrid integration of optical and electronic components on a silicon motherboard
Author :
Jones, C.A. ; Cooper, K. ; Nield, M.W. ; Rush, J.D. ; Collins, J.V. ; Hall, I.P. ; McDonna, A.P. ; Brown, S.J.
Author_Institution :
British Telecom Res. Labs., Ipswich, UK
fDate :
31 Oct-3 Nov 1994
Abstract :
We have demonstrated silicon motherboard transmitter and receiver modules with planar silica waveguide optical interconnects. In both modules the active optoelectronic components were passively aligned to the silica waveguides, and electronic circuitry was also hybrid integrated. We are now- developing motherboards which include an electrical interconnect layer formed directly on the silicon, in order to overcome the limitations encountered with bond-wires
Keywords :
silicon; Si; SiO2; active optoelectronic components; electrical interconnect layer; electronic circuitry; electronic components; hybrid integrated; hybrid integration; optical components; passively aligned; planar silica waveguide optical interconnects; receiver modules; silicon motherboard; silicon motherboard transmitter modules; Electronic components; Integrated optics; Optical devices; Optical interconnections; Optical planar waveguides; Optical receivers; Optical transmitters; Optical waveguides; Planar waveguides; Silicon compounds;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-1470-0
DOI :
10.1109/LEOS.1994.586538
