Title :
A miniaturized high performance power amplifier module for 3G handset application
Author :
Bi, Xiaojun ; Xu, Qinfen ; Zhang, Haiying
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing
Abstract :
This paper presents the design of a TD-SCDMA PA with gain of 28.5 dBm (18 dBm), high efficiency of 43% (15%), low distortion with an ACPR of -43 dBc (-39 dBc) and small size of 0.91 times 0.98 mm2 to meet the requirement of TD-SCDMA handset terminals. In addition, a novel power amplifier module with the output match in LTCC package is proposed. Smaller size and lower power loss can be achieved. The overall module size can be as small as 2.4 times 2.4 mm2.The high performance and small chip size of the MMIC and module offers the potential for low cost production.
Keywords :
3G mobile communication; MMIC power amplifiers; ceramics; code division multiple access; mobile handsets; 3G mobile handsets; LTCC package; MMIC power amplifiers; TD-SCDMA; code division multiple access; Capacitors; Circuits; High power amplifiers; Impedance matching; Inductors; MMICs; Power amplifiers; Power generation; Radiofrequency amplifiers; Telephone sets;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958291
