• DocumentCode
    3486467
  • Title

    A miniaturized high performance power amplifier module for 3G handset application

  • Author

    Bi, Xiaojun ; Xu, Qinfen ; Zhang, Haiying

  • Author_Institution
    Inst. of Microelectron., Chinese Acad. of Sci., Beijing
  • fYear
    2008
  • fDate
    16-20 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the design of a TD-SCDMA PA with gain of 28.5 dBm (18 dBm), high efficiency of 43% (15%), low distortion with an ACPR of -43 dBc (-39 dBc) and small size of 0.91 times 0.98 mm2 to meet the requirement of TD-SCDMA handset terminals. In addition, a novel power amplifier module with the output match in LTCC package is proposed. Smaller size and lower power loss can be achieved. The overall module size can be as small as 2.4 times 2.4 mm2.The high performance and small chip size of the MMIC and module offers the potential for low cost production.
  • Keywords
    3G mobile communication; MMIC power amplifiers; ceramics; code division multiple access; mobile handsets; 3G mobile handsets; LTCC package; MMIC power amplifiers; TD-SCDMA; code division multiple access; Capacitors; Circuits; High power amplifiers; Impedance matching; Inductors; MMICs; Power amplifiers; Power generation; Radiofrequency amplifiers; Telephone sets;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. APMC 2008. Asia-Pacific
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-2641-6
  • Electronic_ISBN
    978-1-4244-2642-3
  • Type

    conf

  • DOI
    10.1109/APMC.2008.4958291
  • Filename
    4958291
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3486467