DocumentCode :
3486497
Title :
Transmit/receive front-end electronics for 3D acoustic imaging
Author :
Çiçek, Ihsan ; Bozkurt, Alican ; Karaman, Ve Mustafa
Author_Institution :
Sabanci Universitesi, Istanbul, Turkey
fYear :
2004
fDate :
28-30 April 2004
Firstpage :
438
Lastpage :
441
Abstract :
Medical ultrasonic imaging systems, in general, are composed of a transducer element and the transmit/receive electronics. One dimensional arrays produce a two-dimensional cross-sectional image of the medium. With recent advances in transducer technology, the fabrication of 2D arrays became feasible; they can be used for 3D (volumetric) imaging (Oralkan, Ö. et al., IEEE Trans. Ultrasonics, Ferroelectrics and Frequency Control, vol.49, no.11, p.1596-610, 2002; Proc. IEEE Ultrasonics Symp., p.1083-86, 2002). However, the Nyquist criterion restricts transducer dimensions, which results in relatively less sensitive array elements. Consequently, for an image of acceptable quality, the receiver electronics must be improved. The design of CMOS based transmit/receive front-end electronics for 2D transducer arrays is described. The circuit is composed of a high voltage pulser, a transmit/receive switch, a low noise amplifier, and a bonding pad for connection to the transducer element.
Keywords :
CMOS integrated circuits; acoustic receivers; amplifiers; biomedical equipment; biomedical ultrasonics; integrated circuit design; pulse circuits; ultrasonic transducer arrays; 2D acoustic arrays; 2D transducer arrays; 3D acoustic imaging; CMOS circuits; Nyquist criterion; bonding pad; high voltage pulser; low noise amplifier; medical ultrasonic imaging systems; transmit-receive switch; transmit/receive front-end electronics; volumetric imaging; Acoustic imaging; Acoustic transducers; Biomedical imaging; Biomedical transducers; Fabrication; Ferroelectric materials; Pulse amplifiers; Switches; Ultrasonic imaging; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing and Communications Applications Conference, 2004. Proceedings of the IEEE 12th
Print_ISBN :
0-7803-8318-4
Type :
conf
DOI :
10.1109/SIU.2004.1338557
Filename :
1338557
Link To Document :
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