Title :
Coplanar waveguides on gold-doped high resistivity silicon for 67-GHz microwave application
Author :
Hashim, Nur Z. I. ; Abuelgasim, Abdelgadir ; De Groot, C.H.
Author_Institution :
Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
Abstract :
High resistivity handle wafers suitable for radio frequency integrated circuit application have been achieved through deep level doping compensation technique. Ion implantation and subsequent annealing were used to introduce electrically active gold atoms into silicon resulting in an increase in resistivity up to 70 kOhm-cm from a nominal value of 50 Ohm-cm. At 67GHz, attenuation loss for coplanar waveguides shows a strong reduction from 0.88 dB/mm obtained from un-implanted wafers to 0.3 dB/mm in gold-implanted wafers.
Keywords :
annealing; coplanar waveguides; elemental semiconductors; gold; ion implantation; millimetre wave integrated circuits; semiconductor doping; silicon; Au; Si; attenuation loss; coplanar waveguides; deep level doping compensation technique; electrically-active gold atoms; frequency 67 GHz; gold-doped high-resistivity silicon; gold-implanted wafers; ion implantation; radiofrequency integrated circuit application; resistivity 50 ohmcm to 70 kohmcm; subsequent annealing; un-implanted wafers; Attenuation; Conductivity; Coplanar waveguides; Gold; Radio frequency; Silicon; Substrates; attenuation loss; coplanar waveguides; high resistivity silicon; radio frequency integrated circuits;
Conference_Titel :
RF and Microwave Conference (RFM), 2013 IEEE International
Conference_Location :
Penang
Print_ISBN :
978-1-4799-2213-0
DOI :
10.1109/RFM.2013.6757265