Title :
Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction
Author :
Mogal, Hushrav D. ; Bazargan, Kia
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN
Abstract :
This paper presents a new approach to active sub-threshold leakage reduction using task migration. The main idea is to replicate a hot module in a design so as to actively migrate its computation at regular intervals, reducing the on-chip temperature and thereby the sub-threshold leakage. We observe that choosing which blocks to migrate and their placement in a floorplan is a chicken-and-egg problem. To solve this, we propose a two step floorplanning methodology, wherein, given a base floorplan, we first choose the modules to replicate and then effectively utilize the deadspaces in it by exploiting the lateral conduction of heat in the floorplan to place a modulepsilas replica. With an optimized floorplan, using task migration we obtain an average savings of 29% in the active sub-threshold leakage at the expense of about 6% additional area.
Keywords :
CMOS integrated circuits; integrated circuit design; transistors; CMOS; active sub-threshold leakage reduction; chicken-and-egg problem; hot module design; low transistor threshold voltage; on-chip temperature; task migration; thermal-aware floorplanning; Circuits; Disaster management; Silicon; Subthreshold current; Temperature dependence; Temperature sensors; Thermal engineering; Thermal management; Threshold voltage; Voltage control;
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
DOI :
10.1109/ICCAD.2008.4681590