Title :
Trends in microelectronics packaging and interconnection
Author :
Chung, Tom ; Haskell, Bert
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Functions and definitions of electronics packaging-along with product-oriented electronics packaging and interconnection technologies, including roadmap and packaging requirements for portable electronics in the year 2000, are reviewed. It has been determined that high-density packaging is the major product driving force in today´s highly competitive electronics industry. Accordingly, major trends and developments in microelectronics packaging and interconnection are presented and discussed
Keywords :
integrated circuit interconnections; integrated circuit packaging; reviews; technological forecasting; electronics industry; high-density packaging; microelectronics interconnection; microelectronics packaging; portable electronics; product-oriented electronics packaging; roadmap requirements; trends; Bonding; Cameras; Costs; Electronics packaging; Flip chip; Integrated circuit packaging; Microelectronics; Personal digital assistants; Video equipment; Wire;
Conference_Titel :
Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
Conference_Location :
Penang
Print_ISBN :
0-7803-3388-8
DOI :
10.1109/SMELEC.1996.616438
