Recent advances in integration of antennas on silicon chip and on ceramic package

Author

Zhang, Y.P.

Author_Institution

Integrated Syst. Res. Lab., Nanyang Technol. Univ., Singapore, Singapore

fYear

2005

fDate

7-9 March 2005

Firstpage

151

Lastpage

154

Abstract

Driven by the huge demand for low-cost high-speed wireless communication devices, the single-chip solutions of wireless transceivers have received considerable attention. This paper reports recent achievements in the integration of a quasi-Yagi antenna on a silicon substrate of low resistivity and then in the integration of a microstrip patch antenna on a ceramic ball grid array (CBGA) package.

Keywords

Yagi antenna arrays; ball grid arrays; ceramic packaging; integrated circuit packaging; microstrip antennas; millimetre wave antenna arrays; 5.67 GHz; 60 GHz; CBGA; ceramic ball grid array package; chip integrated antennas; low resistivity antenna substrate; microstrip patch antenna; quasi-Yagi antenna; single-chip wireless transceivers; CMOS process; CMOS technology; Ceramics; Conductivity; Integrated circuit technology; Millimeter wave technology; Packaging; Silicon; Substrates; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Antenna Technology: Small Antennas and Novel Metamaterials, 2005. IWAT 2005. IEEE International Workshop on

Print_ISBN

0-7803-8842-9

Type

conf

DOI

10.1109/IWAT.2005.1461032

Filename

1461032

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3488244