• DocumentCode
    3488358
  • Title

    Using test data to improve IC quality and yield

  • Author

    Gattiker, Anne

  • Author_Institution
    IBM Res., Austin Res. Lab., Austin, TX
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    771
  • Lastpage
    777
  • Abstract
    The complexity of interactions in todaypsilas manufacturing processes makes test structures and experiments inadequate as sole drivers of yield-learning and design-for-manufacturing [DfM]. They must be driven by product impact. Product-impact-oriented test-based learning provides insight into the nature of model-hardware mismatches and variability that exist on and impact real products. That insight can be used to drive both parametric and defect-oriented process actions and DfM.
  • Keywords
    design for manufacture; integrated circuit testing; integrated circuit yield; design-for-manufacturing; integrated circuit quality; integrated circuit yield; model-hardware mismatches; product-impact-oriented test; test data; Circuit testing; Design for manufacture; FETs; Frequency; Integrated circuit testing; Manufacturing processes; Packaging; Power measurement; Process design; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-2819-9
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2008.4681663
  • Filename
    4681663