Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Author

Huang, Z. ; Guidotti, Daniel ; Chang, Gee-Kung ; Liu, Jiangchuan ; Liu, Frank ; Chang, Y.-J. ; Tummala, Rao

fYear

2004

fDate

28-30 June 2004

Firstpage

13

Lastpage

14

Abstract

In this paper, a process is outlined for the integration of commercial bare die VCSEL and PiN PDs embedded in polymer waveguide on inexpensive printed wiring board (PWB) boards. The evanescent coupling efficiency of both PiN and metal-semiconductor-metal (MSM) PD from Siloxane waveguide is measured. This is the first demonstration of a process for embedding commercial PiN PDs in polymer waveguide for high speed chip to chip optical interconnects. Optoelectronic devices embedded in Siloxane waveguide on FR4 board such as embedded MSM PD in waveguide, PiN PD embedded in waveguide, embedded VCSEL and PiN on board and embedded VCSEL in waveguide with end mirror.

Keywords

integrated optoelectronics; metal-semiconductor-metal structures; optical fabrication; optical interconnections; optical polymers; optical waveguides; p-i-n photodiodes; photodetectors; surface emitting lasers; FR4 board; MSM photodetector; PWB boards; PiN PD; Siloxane waveguide; bare die VCSEL; evanescent coupling efficiency; high speed chip to chip optical interconnects; metal-semiconductor-metal; optoelectronic devices; polymer waveguide; printed wiring board; Bonding; Buffer layers; Optical interconnections; Optical surface waves; Optical waveguides; Optoelectronic devices; Photodetectors; Polymers; Refractive index; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS Summer Topical Meetings

ISSN

1099-4742

Print_ISBN

0-7803-8306-0

Type

conf

DOI

10.1109/LEOSST.2004.1338681

Filename

1338681