DocumentCode :
3488589
Title :
WearMon: Reliability monitoring using adaptive critical path testing
Author :
Zandian, Bardia ; Dweik, Waleed ; Kang, Suk Hun ; Punihaole, Thomas ; Annavaram, Murali
Author_Institution :
Electr. Eng. Dept., Univ. of Southern California, Los Angeles, CA, USA
fYear :
2010
fDate :
June 28 2010-July 1 2010
Firstpage :
151
Lastpage :
160
Abstract :
As processor reliability becomes a first order design constraint, this research argues for a need to provide continuous reliability monitoring. We present WearMon, an adaptive critical path monitoring architecture which provides accurate and real-time measure of the processor´s timing margin degradation. Special test patterns check a set of critical paths in the circuit-under-test. By activating the actual devices and signal paths used in normal operation of the chip, each test will capture up-to-date timing margin of these paths. The monitoring architecture dynamically adapts testing interval and complexity based on analysis of prior test results, which increases efficiency and accuracy of monitoring. Experimental results based on FPGA implementation show that the proposed monitoring unit can be easily integrated into existing designs. Monitoring overhead can be reduced to zero by scheduling tests only when a unit is idle.
Keywords :
circuit reliability; circuit testing; critical path analysis; microprocessor chips; monitoring; WearMon; adaptive critical path monitoring architecture; adaptive critical path testing; circuit under test; first order design constraint; processor reliability; processors timing margin degradation; reliability monitoring; up-to-date timing margin; Circuit testing; Condition monitoring; Electric breakdown; Field programmable gate arrays; Niobium compounds; Semiconductor device measurement; System testing; Thermal degradation; Timing; Titanium compounds; Critical Paths; Reliability; Timing Margins;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Dependable Systems and Networks (DSN), 2010 IEEE/IFIP International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-7500-1
Electronic_ISBN :
978-1-4244-7499-8
Type :
conf
DOI :
10.1109/DSN.2010.5544916
Filename :
5544916
Link To Document :
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