Title :
Emerging device nanotechnology for future high-speed and energy-efficient VLSI: Challenges and opportunities
Author_Institution :
Technol. & Manuf. Group, Intel Corp., Hillsboro, OR
Abstract :
Emerging device nanotechnologies as well as their integration on large silicon wafers present both challenges and opportunities for future high-speed and energy-efficient digital VLSI applications.
Keywords :
VLSI; digital integrated circuits; nanotechnology; digital VLSI applications; large silicon wafers; nanotechnology device; CMOS technology; Energy efficiency; III-V semiconductor materials; MOSFETs; Nanotechnology; Photonic band gap; Quantum well devices; Silicon; Substrates; Very large scale integration;
Conference_Titel :
Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-2363-7
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2008.4681688
