DocumentCode
3488833
Title
A 65nm test structure for the analysis of NBTI induced statistical variation in SRAM transistors
Author
Fischer, Thomas ; Amirante, Ettore ; Hofmann, Karl ; Ostermayr, Martin ; Huber, Peter ; Schmitt-Landsiedel, Doris
Author_Institution
Tech. Univ. Munchen, Munchen
fYear
2008
fDate
15-19 Sept. 2008
Firstpage
51
Lastpage
54
Abstract
We present the results of a test structure that allows to measure the variation of SRAM p-MOS and n-MOS transistors in a dense environment and to apply Negative Bias Temperature Instability (NBTI) stress on the p-MOS transistors. The threshold voltage (Vth) and drain current (Id) distributions of p-MOS SRAM transistors pre and post NBTI Stress are measured and analyzed. The probability density functions (PDF) of both transistor parameters Vth and Id follow a Gaussian distribution pre and post NBTI stress, but the difference in the transistor parameters of an individual device is not Gaussian distributed. The standard deviation in the difference of Vth is about 50% of the mean for the small SRAM p-MOS transistor. The impact of the additional variation induced by NBTI stress is shown for the Static Noise Margin of a 6-T SRAM cell.
Keywords
Gaussian distribution; MOSFET; SRAM chips; Gaussian distribution; SRAM transistors; drain current distributions; induced statistical variation; n-MOS transistors; negative bias temperature instability; p-MOS transistors; probability density functions; size 65 nm; static noise margin; threshold voltage distributions; Current measurement; Gaussian distribution; Negative bias temperature instability; Niobium compounds; Probability density function; Random access memory; Stress measurement; Testing; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European
Conference_Location
Edinburgh
ISSN
1930-8876
Print_ISBN
978-1-4244-2363-7
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2008.4681696
Filename
4681696
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