Title :
EMC performance of IC packages
Author :
Rollin, J.J. ; Areari, G. ; Roy, L.
Author_Institution :
Nortel Networks, Ottawa, Ont., Canada
Abstract :
There are obvious benefits to controlling electromagnetic interference (EMI) directly at the chip level through appropriate integrated circuit (IC) packaging. This paper presents radiated emission levels of Plastic Ball Grid A-ray (PBGA) and Super Ball Grid Array (SBGA) packages up to 10 GHz, and examines the features that can lead to improved performance. It is concluded that the electromagnetic compatibility (EMC) characteristics of SBGA packages are substantially better than those of PBGA packages. Any further EMC improvements are highly dependant on the SBGA grounding configuration employed
Keywords :
ball grid arrays; electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; integrated circuit packaging; integrated circuit testing; loop antennas; plastic packaging; 0 to 10 GHz; EMC performance; EMI; IC packages; PBGA; Plastic Ball Grid A-ray; SBGA; Super Ball Grid Array; chip level; electromagnetic compatibility; electromagnetic interference; grounding configuration; integrated circuit packaging; radiated emission levels; Antenna measurements; Application specific integrated circuits; Circuit testing; Dipole antennas; Electromagnetic compatibility; Electromagnetic interference; Electronics packaging; Integrated circuit packaging; Integrated circuit testing; Lead;
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
DOI :
10.1109/ISEMC.1999.812865
