DocumentCode :
348923
Title :
Experiments on relationship between electromagnetic noise and surface profile change by arc discharge of heterogeneous material contacts
Author :
Ebara, Yasuo ; Koizumi, Toshiaki ; Sone, Hideaki ; Nemoto, Yoshiaki
Author_Institution :
Graduate Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
Volume :
1
fYear :
1999
fDate :
1999
Firstpage :
165
Abstract :
The authors have observed a relationship between the waveforms of electromagnetic noise and a change of surface for arc discharges of opening Cu-C and Ag-Pd material electric contacts. In the case of Cu-C electrodes, the waveforms of electromagnetic noise and the changes of the electrode surface are affected by electric current polarity. By classification of the noise waveform pattern, the authors showed a close relationship between noise and change of surface. The noise level of Pd(anode)-Ag(cathode) increases in the middle of arc duration, and decreases in the latter half. In high noise level conditions, a change of color on the surfaces of both electrodes was found for Pd(anode)-Ag(cathode). The pattern of noise occurrence depends mainly on the cathode material
Keywords :
anodes; arcs (electric); carbon; cathodes; copper; electrical contacts; electromagnetic interference; palladium; silver; surface topography; Ag; Ag-Pd electrodes; Ag-Pd material electric contacts; C; Cu; Cu-C electrodes; Cu-C material electric contacts; Pd; arc discharge; classification; color; electric current polarity; electromagnetic noise; heterogeneous material contacts; high noise level conditions; noise level; surface profile change; waveforms; Arc discharges; Cathodes; Colored noise; Current; Electrodes; Electromagnetic interference; Electromagnetic scattering; Noise level; Surface discharges; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
Type :
conf
DOI :
10.1109/ISEMC.1999.812888
Filename :
812888
Link To Document :
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