Title :
Anticipating EMI from coupling between high-speed digital and I/O lines
Author :
Cui, W. ; Li, M. ; Luo, X. ; Drewniak, J.L. ; Hubing, T.H. ; VanDoren, T.P. ; Du Broff, R.E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
Abstract :
The increasing speed of digital circuit design as well as the density of printed circuit board (PCB) layouts often result in more challenging electromagnetic interference (EMI) problems. The coupling between a high-speed digital line and an I/O line can be a primary EMI coupling path, and the attached cable a dominant radiator. This mechanism is studied and modeled herein in a multi-stage modeling fashion. EMI modeling is developed for coupling between the transmission lines, and the attached cable as the EMI antenna. Finally, the EMI is calculated for the coupled noise driving the attached cable. The agreement between the modeled and measured results demonstrates that the modeling method is suitable for estimating the EMI due to high-frequency coupling to I/O lines
Keywords :
coupled transmission lines; digital circuits; electric current measurement; electric impedance measurement; electric noise measurement; electromagnetic coupling; electromagnetic interference; microstrip lines; noise; printed circuit layout; strip lines; transmission line theory; EMI antenna; EMI coupling path; EMI estimation; EMI modeling; I/O lines; PCB layout density; cable; coupled noise; coupled transmission lines; digital circuit design; electromagnetic interference; high-frequency coupling; high-speed digital lines; measured results; microstrip; multi-stage modeling; printed circuit board layout; radiator; stripline; transmission lines coupling; Computational geometry; Connectors; Coupling circuits; Crosstalk; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic modeling; Power cables; Transmission line antennas; Transmission lines;
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
DOI :
10.1109/ISEMC.1999.812893
