DocumentCode
348955
Title
An investigation on power plane decoupling for high speed multiprocessor boards
Author
Nuebel, Joe ; Roy, Tanmoy ; Das, Sudip
Author_Institution
Sun Microsyst. Inc., Palo Alto, CA, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
355
Abstract
New generations of high speed processors are requiring more power. Consequently in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper an investigation has been conducted to find out the effects of decoupling capacitors on SI and EMC. A procedure for optimizing the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and the emissions were measured in a semi-anechoic chamber. The authors have tried to find out the effect of the decoupling strategy on both SI and EMI
Keywords
capacitors; electromagnetic compatibility; electromagnetic coupling; multiprocessing systems; printed circuit testing; EMC; SI; decoupling capacitors; decoupling strategy; dual processor board; fundamental frequency; harmonic frequencies; high speed multiprocessor boards; high speed processors; power plane decoupling; signal integrity; switching currents; Capacitors; Degradation; Electromagnetic compatibility; Electromagnetic interference; Frequency; Geometry; Impedance; Noise level; Power engineering and energy; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-5057-X
Type
conf
DOI
10.1109/ISEMC.1999.812927
Filename
812927
Link To Document