• DocumentCode
    348955
  • Title

    An investigation on power plane decoupling for high speed multiprocessor boards

  • Author

    Nuebel, Joe ; Roy, Tanmoy ; Das, Sudip

  • Author_Institution
    Sun Microsyst. Inc., Palo Alto, CA, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    355
  • Abstract
    New generations of high speed processors are requiring more power. Consequently in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper an investigation has been conducted to find out the effects of decoupling capacitors on SI and EMC. A procedure for optimizing the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and the emissions were measured in a semi-anechoic chamber. The authors have tried to find out the effect of the decoupling strategy on both SI and EMI
  • Keywords
    capacitors; electromagnetic compatibility; electromagnetic coupling; multiprocessing systems; printed circuit testing; EMC; SI; decoupling capacitors; decoupling strategy; dual processor board; fundamental frequency; harmonic frequencies; high speed multiprocessor boards; high speed processors; power plane decoupling; signal integrity; switching currents; Capacitors; Degradation; Electromagnetic compatibility; Electromagnetic interference; Frequency; Geometry; Impedance; Noise level; Power engineering and energy; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-5057-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.1999.812927
  • Filename
    812927