A cooperative research for experimental characterization of signal integrity in deep submicron integrated circuits

Author

Sicard, E. ; Delmas, S. ; Caignet, F. ; de Smedt, R. ; Steinecke, T. ; Ferrante, J.G. ; Saintot, P.

Author_Institution

Inst. Nat. des Sci. Appliquees, Toulouse, France

Volume

1

fYear

1999

fDate

1999

Firstpage

361

Abstract

The following paper describes a cooperative project between four major European industries and one academic institute, on the development of a novel measurement method for the precise characterization of signal integrity. The method has been implemented in 0.35, 0.25 and 0.18 μm CMOS technology, and several aspects of signal integrity have been investigated: interconnect delay, crosstalk within interconnects, delay induced by crosstalk and power supply lines fluctuations. Details on the method and the milestones of the project are reported in the paper

Keywords

CMOS integrated circuits; crosstalk; electromagnetic compatibility; integrated circuit interconnections; integrated circuit testing; 0.18 micron; 0.25 micron; 0.35 micron; CMOS; crosstalk; deep submicron integrated circuits; delay; interconnect delay; power supply lines fluctuation; signal integrity; CMOS technology; Capacitance; Crosstalk; Delay effects; Electromagnetic compatibility; Integrated circuit interconnections; Integrated circuit technology; Power supplies; Propagation delay; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-5057-X

Type

conf

DOI

10.1109/ISEMC.1999.812928

Filename

812928