• DocumentCode
    348962
  • Title

    An investigation of the effects of PCB module orientation on radiated EMI

  • Author

    Haockanson, D. ; Radu, Sergiu

  • Author_Institution
    Sun Microsyst. Inc., Palo Alto, CA, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    399
  • Abstract
    Electronic equipment is frequently designed with modular construction to more efficiently use available real-estate, as well as provide for expansion capability and interchangeability. Perpendicular and parallel module configurations are both reasonably common, although perpendicular modules are becoming more prevalent with the standardization of the PCI bus in the computing industry. Modular designs may behave as EMI antennas if excited by a common-mode noise source. Magnetic- and electric-field coupling mechanisms have previously been documented that may excite the EMI antenna at the module bus-connector or on the module. The antenna and transmission-line characteristics of the perpendicular and parallel modules were investigated numerically and experimentally. A case study of a commercially available product using the parallel-module configuration is provided to show the relevance of modules as EMI antennas
  • Keywords
    electromagnetic coupling; electromagnetic interference; modules; printed circuit layout; transmission lines; transmitting antennas; EMI antennas; PCB module orientation; PCI bus; common-mode noise source; coupling mechanisms; electric-field; magnetic-field; modular construction; module bus-connector; parallel module configurations; perpendicular module configurations; radiated EMI; transmission-line characteristics; Computer industry; Concurrent computing; Construction industry; Couplings; Electrical equipment industry; Electromagnetic interference; Electronic equipment; Magnetic noise; Modular construction; Standardization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-5057-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.1999.812936
  • Filename
    812936