Title :
A comprehensive shear-testing facility for joint-scale solder samples
Author :
Herkommer, Dominik ; Reid, Michael ; Punch, Jeff
Author_Institution :
Stokes Res. Inst., Univ. of Limerick, Limerick
Abstract :
This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. In-situ observation of the solder joint can be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results at room temperature on Sn96.5Ag3.0Cu0.5 and eutectic Sn63Pb37 solder are presented. Secondary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.
Keywords :
copper alloys; creep testing; lead alloys; silver alloys; solders; tin alloys; SnAgCu; SnPb; creep test; eutectic solder; in-situ observation; joint-scale solder samples; microstructural studies; secondary creep strain-transition; shear testing apparatus; shear-testing facility; Assembly; Costs; Creep; Environmentally friendly manufacturing techniques; Lead; Life testing; Manufacturing processes; Materials testing; Soldering; Temperature;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525011
