• DocumentCode
    3489707
  • Title

    A New Methodology For RF MEMS Contact Simulation

  • Author

    Peyrou, D. ; Coccetti, F. ; Pennec, F. ; Achkar, H. ; Pons, P. ; Plana, R.

  • Author_Institution
    LAAS-CNRS, Toulouse Univ., Toulouse
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Until nowadays, surface roughness effects were ignored in the analysis, due to the difficulty to generate a rough surface model and also to simplify the model in order to reduce calculation time. However, many engineering fields, such as MEMS, seek to improve the behaviour of the system at the surface level or the interface between surfaces. Thus, with the advance of numerical capabilities, the topography of the surface can be included in finite element simulations. This paper presents two methods for generating rough surfaces, one using the real shape with an original reverse engineering method and the other one by using a parametric design language to generate a normally distributed rough surface. As an application to demonstrate the power of these methods, we choose to predict by simulation the electrical contact resistance and the real contact area between rough surfaces as a function of the contact force. This application is a major concern in RF MEMS ohmic switches and shows an original approach to extract a guideline in choosing a design, materials and process flow to minimize the contact resistance. The agreement between the numerical model and an analytical model is very good and validates this novel numeric approach.
  • Keywords
    finite element analysis; microswitches; rough surfaces; RF MEMS ohmic switches; electrical contact resistance; finite element simulations; numerical approach; parametric design language; rough surface model; topography; Contact resistance; Distributed power generation; Finite element methods; Micromechanical devices; Radiofrequency microelectromechanical systems; Rough surfaces; Shape; Surface resistance; Surface roughness; Surface topography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Electronic_ISBN
    978-1-4244-2128-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525016
  • Filename
    4525016