DocumentCode :
3489707
Title :
A New Methodology For RF MEMS Contact Simulation
Author :
Peyrou, D. ; Coccetti, F. ; Pennec, F. ; Achkar, H. ; Pons, P. ; Plana, R.
Author_Institution :
LAAS-CNRS, Toulouse Univ., Toulouse
fYear :
2008
fDate :
20-23 April 2008
Firstpage :
1
Lastpage :
4
Abstract :
Until nowadays, surface roughness effects were ignored in the analysis, due to the difficulty to generate a rough surface model and also to simplify the model in order to reduce calculation time. However, many engineering fields, such as MEMS, seek to improve the behaviour of the system at the surface level or the interface between surfaces. Thus, with the advance of numerical capabilities, the topography of the surface can be included in finite element simulations. This paper presents two methods for generating rough surfaces, one using the real shape with an original reverse engineering method and the other one by using a parametric design language to generate a normally distributed rough surface. As an application to demonstrate the power of these methods, we choose to predict by simulation the electrical contact resistance and the real contact area between rough surfaces as a function of the contact force. This application is a major concern in RF MEMS ohmic switches and shows an original approach to extract a guideline in choosing a design, materials and process flow to minimize the contact resistance. The agreement between the numerical model and an analytical model is very good and validates this novel numeric approach.
Keywords :
finite element analysis; microswitches; rough surfaces; RF MEMS ohmic switches; electrical contact resistance; finite element simulations; numerical approach; parametric design language; rough surface model; topography; Contact resistance; Distributed power generation; Finite element methods; Micromechanical devices; Radiofrequency microelectromechanical systems; Rough surfaces; Shape; Surface resistance; Surface roughness; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
Type :
conf
DOI :
10.1109/ESIME.2008.4525016
Filename :
4525016
Link To Document :
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