DocumentCode
3489729
Title
Latency insertion method for the analysis of steady state on-chip power distribution networks and transient simulation of lossy interconnects
Author
Klokotov, Dmitri ; Schutt-Aine, José
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
fYear
2008
fDate
16-20 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
Process scaling has led to a significant growth in the number or devices on a chip. Consequently, the length and density of interconnects has increased dramatically. Tradional matrix-vector product based circuit simulations such as SPICE are not computationally efficient for analysis of large circuit problems. This work demonstrates that latency insertion method (LIM) algorithm can be extended to incorporate frequency dependent behavior of circuit elements in the simulation. This method is applied to the analysis of steady-state on-chip power distribution network. Experimental results show that LIM outperforms the random walk method, especially for circuits with large numbers of nodes. Also,expansion of the LIM algorithm to the treatment of networks with frequency-dependent parameters is presented. The ability of the expanded algorithm to model lossy interconnects is demonstrated.
Keywords
circuit simulation; distribution networks; interconnections; SPICE; circuit simulators; frequency dependent behavior; latency insertion method; lossy interconnects; matrix-vector product; steady state on-chip power distribution networks; transient simulation; Analytical models; Circuit simulation; Computational modeling; Delay; Integrated circuit interconnections; Network-on-a-chip; Power systems; SPICE; Steady-state; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location
Macau
Print_ISBN
978-1-4244-2641-6
Electronic_ISBN
978-1-4244-2642-3
Type
conf
DOI
10.1109/APMC.2008.4958455
Filename
4958455
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