DocumentCode
3489742
Title
Can temperature shock tests speed up development of reliable components for automotive applications
Author
Pufall, R. ; Kanert, W.
Author_Institution
Infineon Technol. AG, Neubiberg
fYear
2008
fDate
20-23 April 2008
Firstpage
1
Lastpage
4
Abstract
Experience shows that chip package interaction is a dominant cause for failures of electronic components. Optimising the technology by applying the standard temperature cycling test to detect these failures is very time consuming and not any more compatible with today´s development cycles. This paper provides a decision basis to speed up technology qualification by using TS (thermal shock) instead of TC (thermal cycling).
Keywords
automotive components; automotive electronics; electronic engineering computing; thermal stress cracking; automotive application; chip package interaction; electronic component; temperature cycling test; temperature shock test; thermal shock; Automotive applications; Electric shock; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location
Freiburg im Breisgau
Print_ISBN
978-1-4244-2127-5
Electronic_ISBN
978-1-4244-2128-2
Type
conf
DOI
10.1109/ESIME.2008.4525019
Filename
4525019
Link To Document