Title :
Can temperature shock tests speed up development of reliable components for automotive applications
Author :
Pufall, R. ; Kanert, W.
Author_Institution :
Infineon Technol. AG, Neubiberg
Abstract :
Experience shows that chip package interaction is a dominant cause for failures of electronic components. Optimising the technology by applying the standard temperature cycling test to detect these failures is very time consuming and not any more compatible with today´s development cycles. This paper provides a decision basis to speed up technology qualification by using TS (thermal shock) instead of TC (thermal cycling).
Keywords :
automotive components; automotive electronics; electronic engineering computing; thermal stress cracking; automotive application; chip package interaction; electronic component; temperature cycling test; temperature shock test; thermal shock; Automotive applications; Electric shock; Temperature; Testing;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525019
