DocumentCode
3489881
Title
Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters
Author
Lihua, Liang ; Xuefan, Chen ; Qiang, Wang ; Fei, Liu ; Liu, Yong ; Irving, Scott ; Luk, Timwah
Author_Institution
Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou
fYear
2008
fDate
20-23 April 2008
Firstpage
1
Lastpage
5
Abstract
A series of impact tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu are performed with a wide range of strain rates to get the valid dynamic model parameters input for modeling. By using a split Hopkinson pressure bar (SHPB) experimental system, dynamic stress-strain characteristics data of 95.7Sn3.8Ag0.5Cu are measured. Comparison of the dynamic test data with the quasi-static test data shows that the dynamic stress strength is nearly 4 times greater than the static sresss strength. The saturation stresses of 95.7Sn3.8Ag0.5Cu increase significantly with the rapid increment of the strain rate. The test results have also shown that both the static and dynamic behaviors of 95.7Sn3.8Ag0.5Cu are highly rate dependent Four material constitutive models are introduced. The parameter determination of these constitutive models through data fitting is studied and the related parameters are obtained. Finally, the comparison of the data-fitting constitutive models with experimental data is presented and discussed.
Keywords
copper alloys; impact testing; plastic deformation; silver alloys; solders; stress-strain relations; tin alloys; work hardening; SnAgCu; data fitting; dynamic constitutive model parameters; impact tests; plastic strain hardening; saturation stresses; solder material; split Hopkinson pressure bar system; strain rates; stress strength; stress-strain characteristics; Capacitive sensors; Joining materials; Materials testing; Mechanical factors; Packaging; Performance evaluation; Plastics; Semiconductor materials; Strain measurement; Stress; Dynamic test; Lead-free; SHPB; constitutive model;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location
Freiburg im Breisgau
Print_ISBN
978-1-4244-2127-5
Electronic_ISBN
978-1-4244-2128-2
Type
conf
DOI
10.1109/ESIME.2008.4525027
Filename
4525027
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