• DocumentCode
    3490200
  • Title

    Numerical-experimental comparison of low-g and high-g tests on a polysilicon MEMS accelerometer

  • Author

    Ghisi, A. ; Kalicinski, S. ; Mariani, S. ; De Wolf, I. ; Corigliano, A.

  • Author_Institution
    Dipt. di Ing. Strutturale, Politec. di Milano, Milan
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this work in-situ measurements obtained during low-g and high-g experiments (g being the gravity acceleration), carried out on a polysilicon inertial accelerometer mounted on a PCB-board, are compared with numerical simulations. Tests are carried out at accelerations ranging between 90 and 5500 g. In each test not only the shock waveform and the device response are recorded, but also the MEMS performance is checked. The shock tests are carried out on a device attached on the top of a falling cylinder in a drop testing machine, where the shock impulse is sensed by a quartz accelerometer mounted next to the tested device. The quartz accelerometer output signal is used as input for the numerical analysis at the MEMS length-scale. A three dimensional, finite element model of the packaged sensor is adopted to simulate its mechanical response in the transient regime. Therefore, a comparison with the experimentally measured output voltage of the tested MEMS allows to single out the effects of mechanical nonlinearities.
  • Keywords
    accelerometers; finite element analysis; microsensors; printed circuits; quartz; silicon; PCB-board; finite element model; high-g test; low-g test; mechanical nonlinearity; mechanical response; packaged sensor; polysilicon MEMS accelerometer; quartz accelerometer; shock waveform; transient regime; Acceleration; Accelerometers; Electric shock; Finite element methods; Gravity; Impulse testing; Life estimation; Micromechanical devices; Numerical analysis; Numerical simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Electronic_ISBN
    978-1-4244-2128-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525049
  • Filename
    4525049