Perspective of Low-Power and High-Speed Wireless Inter-Chip Communications for SiP Integration

Author

Kuroda, Tadahiro ; Miura, Noriyuki

Author_Institution

Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama

fYear

2006

fDate

Sept. 2006

Firstpage

3

Lastpage

6

Abstract

Performance gap between computation in a chip and communication between chips is widening. "System in a package" (SiP) reduces chip distance significantly, enabling a high-speed and low-power interface. Electrical non-contact interfaces using inductive/capacitive coupling have advantages over mechanical interfaces employing through silicon vias (TSV) and micro bumps. In this paper, a perspective of using wireless links between stacked chips in a package is presented. Techniques for high-speed and low-power data communications are discussed in various levels from signaling, circuit design, IC layout, and magnetic field design, as well as cross talk analysis and its countermeasures. A 1Tb/s 3W transceiver in 0.18mum CMOS is presented. Both clock and data are transmitted by inductive coupling. 1024 data transceivers are arranged with a pitch of 30mum. A 4-phases time division multiple access (TDMA) technique reduces crosstalk effectively. Measured bit error rate (BER) is lower than 10^-13. Bi-phase modulation (BPM) is employed to improve noise immunity, resulting in power reduction

Keywords

CMOS integrated circuits; data communication; error statistics; integrated circuit layout; low-power electronics; system-in-package; time division multiple access; transceivers; 0.18 micron; 3 W; CMOS transceivers; biphase modulation; bit error rate; computation-in-a-chip; data communications; electrical noncontact interfaces; integrated circuit layout; microbumps; system-in-package; through silicon vias; time division multiple access; wireless inter-chip communications; Bit error rate; Coupling circuits; Crosstalk; Data communication; Packaging; Silicon; Through-silicon vias; Time division multiple access; Transceivers; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2006. ESSCIRC 2006. Proceedings of the 32nd European

Conference_Location

Montreux

ISSN

1930-8833

Print_ISBN

1-4244-0303-0

Type

conf

DOI

10.1109/ESSCIR.2006.307522

Filename

4099695