DocumentCode
3490349
Title
Emerging device nanotechnology for future high-speed and energy-efficient VLSI: Challenges and opportunities
Author
Chau, Robert S.
Author_Institution
Technol. & Manuf. Group, Intel Corp., Hillsboro, OR
fYear
2008
fDate
15-19 Sept. 2008
Firstpage
1
Lastpage
3
Abstract
Emerging device nanotechnologies as well as their integration on large silicon wafers present both challenges and opportunities for future high-speed and energy-efficient digital VLSI applications.
Keywords
VLSI; elemental semiconductors; high-speed integrated circuits; nanoelectronics; silicon; Si; energy-efficient digital VLSI applications; high-speed VLSI; large silicon wafer integration; nanotechnology; CMOS technology; Energy efficiency; III-V semiconductor materials; MOSFETs; Nanotechnology; Photonic band gap; Quantum well devices; Silicon; Substrates; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2008. ESSCIRC 2008. 34th European
Conference_Location
Edinburgh
ISSN
1930-8833
Print_ISBN
978-1-4244-2361-3
Electronic_ISBN
1930-8833
Type
conf
DOI
10.1109/ESSCIRC.2008.4681782
Filename
4681782
Link To Document