Title :
Fast and efficient interconnect modelling using finite element method and model order reduction
Author :
You, Se-Ho ; Kuester, Edward F.
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
As printed circuit conductors are popularly used, the modelling of the electrical behaviour of these interconnect is getting attention. The authors present a method by which SPICE compatible lumped equivalent circuit can be extracted from two-dimensional FEM simulation of transmission line interconnects in a fast and efficient manner. The lumped parameters of the transmission line are obtained by applying a certain type of moment matching to the FEM results. It will also be pointed out that the impedance has only stable poles even though there are unstable poles in both the inductance and the resistance.
Keywords :
SPICE; equivalent circuits; finite element analysis; integrated circuit interconnections; integrated circuit modelling; lumped parameter networks; network synthesis; printed circuits; reduced order systems; semiconductor device models; FEM simulation; SPICE; circuit synthesis; eddy currents; electrical behaviour; finite element method; inductance; interconnect modelling; lumped equivalent circuit; lumped parameters; model order reduction; moment matching; printed circuit conductors; reduced order systems; resistance; transient analysis; transmission line; transmission lines; Circuit simulation; Conductors; Distributed parameter circuits; Equivalent circuits; Finite element methods; Impedance; Inductance; Integrated circuit interconnections; Printed circuits; SPICE;
Conference_Titel :
Microwave Symposium Digest, 2004 IEEE MTT-S International
Print_ISBN :
0-7803-8331-1
DOI :
10.1109/MWSYM.2004.1338825
