DocumentCode
3490426
Title
Fast and efficient interconnect modelling using finite element method and model order reduction
Author
You, Se-Ho ; Kuester, Edward F.
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Volume
3
fYear
2004
fDate
6-11 June 2004
Firstpage
1377
Abstract
As printed circuit conductors are popularly used, the modelling of the electrical behaviour of these interconnect is getting attention. The authors present a method by which SPICE compatible lumped equivalent circuit can be extracted from two-dimensional FEM simulation of transmission line interconnects in a fast and efficient manner. The lumped parameters of the transmission line are obtained by applying a certain type of moment matching to the FEM results. It will also be pointed out that the impedance has only stable poles even though there are unstable poles in both the inductance and the resistance.
Keywords
SPICE; equivalent circuits; finite element analysis; integrated circuit interconnections; integrated circuit modelling; lumped parameter networks; network synthesis; printed circuits; reduced order systems; semiconductor device models; FEM simulation; SPICE; circuit synthesis; eddy currents; electrical behaviour; finite element method; inductance; interconnect modelling; lumped equivalent circuit; lumped parameters; model order reduction; moment matching; printed circuit conductors; reduced order systems; resistance; transient analysis; transmission line; transmission lines; Circuit simulation; Conductors; Distributed parameter circuits; Equivalent circuits; Finite element methods; Impedance; Inductance; Integrated circuit interconnections; Printed circuits; SPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2004 IEEE MTT-S International
ISSN
0149-645X
Print_ISBN
0-7803-8331-1
Type
conf
DOI
10.1109/MWSYM.2004.1338825
Filename
1338825
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