• DocumentCode
    3490544
  • Title

    Cold test and cyclic damp heat test of plastic substrate based displays

  • Author

    Li, Jian-Ping ; Yang, Ping ; Zhong, Jian ; Zhou, Jun ; Xu, Leon ; Chen, Quayle ; Salo, Antti ; Ojala, Kari

  • Author_Institution
    Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The plastic substrate based displays have attracted a lot of interest in recent years because of their potential applications in portable electronic devices. Many of them have high brightness, high contrast, and large angle of view, with the flexibility for accommodating different form factors. However, their reliability in practical applications has not been systematically studied. For many plastic materials, the temperature and humidity reliability are among the biggest concerns. This paper presents an experimental study of the plastic substrate based liquid crystal display with the focus on its reliability under varying temperature and humidity conditions. In this study, the cold test and the cyclic damp heat tests were conducted with visual inspections and electro-optical properties measurement during each test procedure. These provide a solid foundation for further studies on the reliability of displays based on plastic substrate technology in practical applications.
  • Keywords
    electro-optical devices; liquid crystal displays; substrates; testing; cold test; cyclic damp heat tests; electro-optical properties measurement; humidity reliability; liquid crystal display; plastic substrate; portable electronic devices; visual inspections; Brightness; Conducting materials; Crystalline materials; Humidity; Inspection; Liquid crystal displays; Materials reliability; Plastics; Temperature; Testing; cold test; cyclic damp heat test; humidity; plastic substrate based display; reliability; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Electronic_ISBN
    978-1-4244-2128-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525071
  • Filename
    4525071