DocumentCode :
3490649
Title :
Coupled circuit-electromagnetic simulation using time domain integral equation
Author :
Wang, Wen-ju ; Liu, Feng ; Zhou, Dong-Ming ; He, Jian-Guo
Author_Institution :
Sch. of Electron. Sci. & Eng., Nat. Univ. of Defense Technol., Changsha
fYear :
2008
fDate :
16-20 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Time-domain integral equation solvers are highly suited for analyzing the performance of coupled circuit-electromagnetic (EM) systems when broadband information is required or nonlinearities in the system have to be modeled accurately. In this paper, we present a novel coupling scheme for hybridizing TDIE with modified nodal analysis (MNA) used in circuit simulation of linear and nonlinear circuits. The coupling scheme is based on the concept of a coupling current that bridges circuit and EM domains. This approach has the advantage of modeling arbitrarily shaped structures with surface-only formulations, and of incorporating skin effects automatically with no volumetric meshing. The method enables direct solution of circuit- EM equations without the need for generating port models, and permits both circuit and EM excitations which has potential as a signal integrity and as an EMI/EMC modeling tool.
Keywords :
circuit simulation; computational electromagnetics; coupled circuits; electromagnetic coupling; electromagnetic interference; integral equations; time-domain analysis; EM excitations; broadband information; circuit simulation; coupled circuit-electromagnetic simulation; coupled circuit-electromagnetic systems; coupling current; modified nodal analysis; nonlinear circuits; signal integrity; surface-only formulations; time domain integral equation; volumetric meshing; Bridge circuits; Circuit simulation; Coupled mode analysis; Coupling circuits; Information analysis; Integral equations; Nonlinear circuits; Performance analysis; Skin effect; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
Type :
conf
DOI :
10.1109/APMC.2008.4958507
Filename :
4958507
Link To Document :
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