A 600-GHz CMOS focal-plane array for terahertz imaging applications

Author

Pfeiffer, Ullrich R. ; Öjefors, Erik

Author_Institution

High-Freq. & Commun. Technol., Univ. of Wuppertal, Wuppertal

fYear

2008

fDate

15-19 Sept. 2008

Firstpage

110

Lastpage

113

Abstract

A 600-GHz single-chip focal-plane array (FPA) has been fully integrated in a 0.25-mum CMOS process technology. The 3times5 array achieves a room temperature responsivity of 50 kV/W and a noise equivalent power (NEP) of 400 pW/radicHz. Each pixel comprises of an on-chip antenna, an NMOS incoherent power detection circuit based on resistive self-mixing, and a 43-dB amplifier with a 1.6-MHz bandwidth. The pixel size is 150times150 mum² and the overall array size is 680times980 mum² including bondpads. The circuit topology makes it possible to fully integrate terahertz focal-plane arrays for 600-GHz video-rate imaging applications in a low-cost CMOS process technologies for the first time.

Keywords

CMOS integrated circuits; MMIC; focal planes; network topology; submillimetre wave imaging; CMOS focal-plane array; circuit topology; frequency 600 GHz; low-cost CMOS process technologies; terahertz imaging applications; video-rate imaging applications; Bandwidth; Bonding; CMOS process; CMOS technology; Integrated circuit technology; MOS devices; Optical imaging; Power amplifiers; Submillimeter wave technology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2008. ESSCIRC 2008. 34th European

Conference_Location

Edinburgh

ISSN

1930-8833

Print_ISBN

978-1-4244-2361-3

Electronic_ISBN

1930-8833

Type

conf

DOI

10.1109/ESSCIRC.2008.4681804

Filename

4681804