DocumentCode :
3490692
Title :
Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches
Author :
Bielen, Jeroen ; Stulemeijer, Jiri ; Ganjoo, Deepak ; Ostergaard, Dale ; Noijen, Sander
Author_Institution :
Innovation Centre for RF, Nijmegen
fYear :
2008
fDate :
20-23 April 2008
Firstpage :
1
Lastpage :
8
Abstract :
For predicting dynamic responses of electrostatically actuated RF-MEMS it is imperative to be able to include fluid squeeze film effects (air damping) in a directly coupled electrostatic-mechanical model, in an efficient and accurate way. This paper presents the modeling methodology to predict the dynamic response of a capacitive RF-MEMS obtained with implementation of a isothermal non-linear compressible Reynolds equation in a directly coupled fluid-structural element in a pre-release of the Ansys FE software. Multi-physics simulations of harmonic (AC) responses and transient switching cycles, in which the switch closes and non-linear contact is included, were validated with measurements. It is concluded that the presented multi-physics model is a powerful tool for virtual device design and indispensable for predicting functional performance of RF-MEMS. This model provides more accurate transient results than models based on the linearized Reynolds equations.
Keywords :
dynamic response; harmonics; microswitches; transient analysis; Ansys FE software; RF-MEMS capacitive switches; air damping; coupled electrostatic-mechanical model; coupled fluid-structural element; dynamic response prediction; electrostatically actuated RF-MEMS; fluid squeeze film effects; fluid-electrostatic-mechanical modeling; harmonic responses; isothermal nonlinear compressible Reynolds equation; multiphysics simulations; nonlinear contact; transient switching; virtual device design; Capacitance; Damping; Electrodes; Electrostatics; Fluid dynamics; Nonlinear equations; Predictive models; Radio frequency; Radiofrequency microelectromechanical systems; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
Type :
conf
DOI :
10.1109/ESIME.2008.4525083
Filename :
4525083
Link To Document :
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