Title :
Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system
Author :
Tilford, T. ; Sinclair, K.I. ; Goussetis, G. ; Bailey, C. ; Desmulliez, M.P.Y. ; Parrott, A.K. ; Sangster, A.J.
Author_Institution :
Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London
Abstract :
Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results.
Keywords :
curing; electronics packaging; microwave technology; numerical analysis; coupled solver approach; electromagnetic field distribution; encapsulant curing; numerical framework; numerical simulation; open oven variable frequency microwave system; simplified microelectronics package; variable frequency microwave processing system; Curing; Electromagnetic fields; Electromagnetic heating; Frequency; Heat transfer; Microelectronics; Microwave ovens; Numerical simulation; Packaging; Thermal stresses;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525086