• DocumentCode
    3490759
  • Title

    A fully integrated power supply unit for fine grain power management application to embedded Low Voltage SRAMs

  • Author

    Beigné, E. ; Clermidy, F. ; Miermont, S. ; Valentian, A. ; Vivet, P. ; Barasinski, S. ; Blisson, F. ; Kohli, N. ; Kumar, S.

  • Author_Institution
    CEA-LETI, MINATEC, Grenoble
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    138
  • Lastpage
    141
  • Abstract
    In complex embedded applications, optimization and adaptation at run time of both dynamic and leakage power have become an issue at SoC coarse grain. We propose in this paper a fully integrated Power Supply Unit for fine grain DVFS and adaptive leakage control. The proposed PSU offers five power modes and can be easily integrated in any IP unit. The PSU has been implemented and validated in a STMicroelectronics 65 nm technology. Dedicated Low-Voltage SRAMs have been designed to allow full DVFS. Using a Hopping technique, the dynamic power consumption can be reduced by a factor of 35%. Using an Ultra-Cut-Off technique, the static power consumption is strongly reduced in stand-by mode, 18 times better than classical MTCMOS.
  • Keywords
    CMOS integrated circuits; SRAM chips; adaptive control; embedded systems; leakage currents; power supply circuits; system-on-chip; IP unit integration; STMicroelectronics; SoC; adaptive leakage control; dynamic power consumption; embedded low voltage SRAM; fine grain DVFS; fine grain power management application; hopping technique; integrated power supply; size 65 nm; Adaptive control; Dynamic voltage scaling; Energy consumption; Energy management; Low voltage; Power supplies; Programmable control; Random access memory; Switches; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ESSCIRC 2008. 34th European
  • Conference_Location
    Edinburgh
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4244-2361-3
  • Electronic_ISBN
    1930-8833
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2008.4681811
  • Filename
    4681811