• DocumentCode
    3490971
  • Title

    Rapid prototyping using laser restructurable VLSI circuits

  • Author

    Lee, Razak ; Moreno, Wilfrido ; Hernandez, Oscar ; Harrold, Ed ; Whittaker, Denny

  • Author_Institution
    Center for Microelectronics Res., Univ. of South Florida, Tampa, FL, USA
  • fYear
    1993
  • fDate
    28-30 Jun 1993
  • Firstpage
    134
  • Lastpage
    140
  • Abstract
    The development of ASICs is a costly proposition in terms of the technology, equipment, and the time required. The advent of laser restructurable VLSI (LRVLSI), promises the design engineer the capability to interconnect cells that implement generic logic functions (e.g., sum of products) to achieve a higher level of complexity design. An operating environment and infrastructure for rapid prototyping and quick turnaround using laser restructuring of VLSI circuits were developed. The purpose of this facility is threefold: to pursue research on novel interconnect technologies using LRVLSI, to develop the capability of operating in a quick turnaround mode using optimized process parameters, and to maintain standardization and compatibility with commercially available equipment for feasible technology transfer
  • Keywords
    VLSI; application specific integrated circuits; integrated circuit technology; integrated logic circuits; laser beam applications; logic design; ASICs; LRVLSI; generic logic functions; interconnect technologies; laser restructurable VLSI circuits; rapid prototyping; technology transfer; Application specific integrated circuits; Costs; Integrated circuit interconnections; Optical feedback; Optical interferometry; Optical pulses; Optimized production technology; Prototypes; Space vector pulse width modulation; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Rapid System Prototyping, 1993. Shortening the Path from Specification to Prototype. Proceedings., Fourth International Workshop on
  • Conference_Location
    Research Triangle Park, NC
  • Print_ISBN
    0-8186-4300-5
  • Type

    conf

  • DOI
    10.1109/IWRSP.1993.263187
  • Filename
    263187