Title :
Current hardware trends in mobile phones
Author :
Reinikainen, Tommi ; Costa, Angelo ; Freitas, Iramylson ; Asuncao, Eduardo
Author_Institution :
Inst. Nokia de Tecnol., Manaus
Abstract :
Summary form only given. In this presentation we review some of the main trends of the current mobile phone HW, mechanics, electro-mechanics, and materials technologies. This work is based on our several years of analysis and teardowns of various types of phones, by various manufacturers. The main drivers for the technology developments are related to improving performance, reducing costs, and facilitating manufacturing and further miniaturization.We are not making any future predictions, but focus on showing the recent developments and trends in some key technology areas, such as IC packaging, PWB, display, antenna, and mechanics and assembly related solutions.
Keywords :
antennas; assembling; integrated circuit packaging; mobile handsets; IC packaging; PWB; antenna; assembly related solutions; display; electro-mechanics; hardware trends; materials technologies; mobile phones; Assembly; Costs; Displays; Hardware; Integrated circuit packaging; Manufacturing; Materials science and technology; Mobile handsets;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525108
