Title :
Study on heat sink and solder of C-Mount packaged semiconductor laser
Author :
Xi, Daoming ; Zou, Yonggang ; Ma, Xiaohui ; Li, Yang ; Yang, Zibin ; Xu, Li ; Zhao, Wei ; Sui, Qingxue ; Zhang, Zhimin
Author_Institution :
Nat. Key Lab. of High Power Semicond. Lasers, Changchun Univ. of Sci. & Technol., Changchun, China
Abstract :
The selection of semiconductor laser package materials including heat sink and solder has an important impact to the cooling and life of the laser, and thus performing related studies is very important. A C-Mount package semiconductor laser model was established in this paper, and thermal characteristic of different kinds of heat sink materials was simulated by the finite element software ANSYS. The temperature distribution of semiconductor laser was subsequently simulated. Then Cu was selected as heat sink, and In or AuSn was used as a solder, and the thermal stress distribution and thermal deformation of different solder materials were analyzed. The distribution of thermal stress of the semiconductor laser has also been investigated.
Keywords :
cooling; copper; deformation; electronics packaging; finite element analysis; gold alloys; heat sinks; indium; semiconductor lasers; solders; temperature distribution; thermal stresses; tin alloys; ANSYS; AuSn; C-mount packaged semiconductor laser; Cu; In; cooling; finite element software; heat sink; laser life; semiconductor laser package materials; solder; temperature distribution; thermal characteristics; thermal deformation; thermal stress distribution; Heat sinks; Laser modes; Materials; Semiconductor lasers; Stress; Thermal resistance; Thermal stresses; ANSYS; C-Mount package; semiconductor laser; thermal resistance; thermal stress;
Conference_Titel :
Optoelectronics and Microelectronics (ICOM), 2012 International Conference on
Conference_Location :
Changchun, Jilin
Print_ISBN :
978-1-4673-2638-4
DOI :
10.1109/ICoOM.2012.6316218
