Title :
A comparison of fieldbus protocols: LIN 1.3, LIN 2.0, and TTP/A
Author :
Elmenreich, Wilfried ; Krywult, Stefan
Author_Institution :
Inst. of Comput. Eng., Vienna Univ. of Technol.
Abstract :
This paper compares the fieldbus protocols LIN 1.3, LIN 2.07 and TTP/A to the requirements of low-cost body electronic networks in the automotive domain. The examined protocols all aim at distributed smart sensor/actuator networks and provide support for low-cost implementation on standard microcontroller nodes. LIN comes with a rigid specification of the physical layer in order to support interoperability between LIN nodes of different vendors. The LIN specification defines also a complete application framework supporting developing and configuring LIN networks. The TTP/A specification describes a pure communication system and leaves a lot of decisions regarding physical layer, fault detection, redundancy, etc. to the system designer. The time-triggered scheduling of messages leads to a very high data efficiency, even for short messages
Keywords :
automotive electronics; distributed sensors; electronic messaging; fault location; field buses; intelligent actuators; intelligent sensors; microcontrollers; open systems; protocols; scheduling; LIN 1.3; LIN 2.0; TTP-A; automotive domain; body electronic network; distributed smart actuator network; distributed smart sensor network; fault detection; fieldbus protocol; interoperability; local interconnect network; microcontroller; scheduling; short message; time-triggered protocol; Automobiles; Automotive engineering; Communication system control; Field buses; Intelligent actuators; Intelligent sensors; Microcontrollers; Physical layer; Protocols; Transducers;
Conference_Titel :
Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on
Conference_Location :
Catania
Print_ISBN :
0-7803-9401-1
DOI :
10.1109/ETFA.2005.1612600
