Title :
Multiplexed CMOS Sensor Arrays for Die Stress Mapping
Author :
Chen, Yonggang ; Jaeger, Richard C. ; Suhling, Jeffrey C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Alabama Microelectron. Sci. & Technol. Center, Auburn, AL
Abstract :
A multiplexed array of 512 current mirror (CM) type CMOS piezoresistive FET stress sensor cells has been fabricated on an MOSIS tiny chip. Driven by an on-chip counter, the sequentially scanned arrays produce the highest resolution mapping of in-plane normal stress and shear stress in an integrated circuit die reported to date. The stress sensor array is calibrated using a chip-on-beam calibration technique, and the measured stress distributions agree well with finite element simulation results. This close correspondence gives the first indirect proof that the MOS shear stress sensors are truly responding to shear stresses
Keywords :
CMOS integrated circuits; calibration; current mirrors; field effect transistors; finite element analysis; integrated circuits; piezoresistive devices; sensor arrays; stress measurement; CMOS sensor arrays; MOS shear stress sensors; MOSIS tiny chip; chip-on-beam calibration technique; current mirror; die stress mapping; finite element simulation; in-plane normal stress; integrated circuit die; on-chip counter; piezoresistive FET stress sensor cells; Calibration; Counting circuits; FETs; Finite element methods; Integrated circuit measurements; Mirrors; Piezoresistance; Semiconductor device measurement; Sensor arrays; Stress measurement;
Conference_Titel :
Solid-State Circuits Conference, 2006. ESSCIRC 2006. Proceedings of the 32nd European
Conference_Location :
Montreux
Print_ISBN :
1-4244-0303-0
DOI :
10.1109/ESSCIR.2006.307471
