Title :
Affordable high performance InP X-band transceiver module for large aperture phased array applications
Author :
Yang, J.M. ; Aust, M. ; Chung, Y. ; Lee, W. ; Stokes, R. ; Dupery, R. ; Lai, R. ; Gorospe, B. ; Kagiwada, R.
Author_Institution :
Northrop GrummanSpace Technol., Redondo Beach, CA, USA
Abstract :
The objective of this paper is to provide an implementation to construct an affordable and high performance transceiver module which can meet the stringent performance specification required for a large aperture phased array. An InP based transceiver chip set consisting of a HBT power amplifier with >60% PAE and a HEMT LNA consuming < 3mW of DC power is assembled in a low cost BGA package to achieve the performance and cost goal of the module.
Keywords :
III-V semiconductors; MMIC amplifiers; antenna phased arrays; ball grid arrays; heterojunction bipolar transistors; indium compounds; microwave antenna arrays; multichip modules; transceivers; BGA package; DC power; HBT power amplifier; HEMT LNA; InP; MMIC amplifiers; PAE; X-band transceiver module; antenna arrays; large aperture phased array; multichip modules; transceiver chip set; Apertures; Costs; HEMTs; Heterojunction bipolar transistors; Indium phosphide; MMICs; Phased arrays; Pulse amplifiers; Radiofrequency amplifiers; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 2004 IEEE MTT-S International
Print_ISBN :
0-7803-8331-1
DOI :
10.1109/MWSYM.2004.1338938
