Affordable high performance InP X-band transceiver module for large aperture phased array applications

Author

Yang, J.M. ; Aust, M. ; Chung, Y. ; Lee, W. ; Stokes, R. ; Dupery, R. ; Lai, R. ; Gorospe, B. ; Kagiwada, R.

Author_Institution

Northrop GrummanSpace Technol., Redondo Beach, CA, USA

Volume

3

fYear

2004

fDate

6-11 June 2004

Firstpage

1761

Abstract

The objective of this paper is to provide an implementation to construct an affordable and high performance transceiver module which can meet the stringent performance specification required for a large aperture phased array. An InP based transceiver chip set consisting of a HBT power amplifier with >60% PAE and a HEMT LNA consuming < 3mW of DC power is assembled in a low cost BGA package to achieve the performance and cost goal of the module.

Keywords

III-V semiconductors; MMIC amplifiers; antenna phased arrays; ball grid arrays; heterojunction bipolar transistors; indium compounds; microwave antenna arrays; multichip modules; transceivers; BGA package; DC power; HBT power amplifier; HEMT LNA; InP; MMIC amplifiers; PAE; X-band transceiver module; antenna arrays; large aperture phased array; multichip modules; transceiver chip set; Apertures; Costs; HEMTs; Heterojunction bipolar transistors; Indium phosphide; MMICs; Phased arrays; Pulse amplifiers; Radiofrequency amplifiers; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1338938

Filename

1338938