• DocumentCode
    3492151
  • Title

    A 2.4-GHz +25dBm P-1dB linear power amplifier with dynamic bias control in a 65-nm CMOS process

  • Author

    Wang, Po-Chih ; Huang, Kai-Yi ; Kuo, Yu-Fu ; Huang, Ming-Chong ; Lu, Chao-Hua ; Chen, Tzung-Ming ; Chang, Chia-Jun ; Chan, Ka-Un ; Yeh, Ta-Hsun ; Wang, Wen-Shan ; Lin, Ying-Hsi ; Lee, Chao-Cheng

  • Author_Institution
    Realtek Semicond. Corp., Hsinchu
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    490
  • Lastpage
    493
  • Abstract
    A 2.4 GHz linear CMOS power amplifier (PA) for OFDM WLAN application in 65 nm CMOS technology is presented. The cascode PA operating from 3.3 V employs the proposed asymmetric lightly doped drain MOSFET (A-LDD) structure as common-gate stage to sustain large signal stress and 1.2 V core device as common source stage to provide high frequency operation. Beside, dynamic bias technique is used not only to increase efficiency but also improve the linearity. In the measurement, the breakdown voltage of the A-LDD MOSFET can achieve 6.2 V compared to standard I/O device of 5 V. A PA EVM of -29 dB is achieved at output power of 17 dBm with DC current of 173 mA from 3.3 V supply. Also, it reveals the output P1 dB of PA is 25.3 dBm.
  • Keywords
    CMOS analogue integrated circuits; OFDM modulation; UHF power amplifiers; electric breakdown; wireless LAN; OFDM WLAN application; asymmetric lightly doped drain MOSFET; breakdown voltage; cascode PA operation; current 173 mA; dynamic bias control; frequency 2.4 GHz; linear CMOS power amplifier; size 65 nm; voltage 1.2 V; voltage 3.3 V; voltage 5 V; CMOS process; CMOS technology; Current measurement; Linearity; MOSFET circuits; OFDM; Power amplifiers; Power measurement; Stress; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ESSCIRC 2008. 34th European
  • Conference_Location
    Edinburgh
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4244-2361-3
  • Electronic_ISBN
    1930-8833
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2008.4681899
  • Filename
    4681899